7.8high
CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MD…
Published 7 y ago · modified 4 mo ago · JSON
CVSS
7.8
v3.0 · NVD
CISA KEV
No
not known exploited
EPSS
0.2%
percentile 16%
Public exploits
0
none known
Summary
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Exploit prediction (EPSS)
0.24% probability of exploitation in the next 30 days, higher than 16% of all scored CVEs.
CVSS scores
| Assigned by | Version | Score | Vector |
|---|---|---|---|
| NVD | 3.0 | 7.8 | CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H |
| NVD | 2.0 | 7.2 | AV:L/AC:L/Au:N/C:C/I:C/A:C |
Affected products
- Qualcomm Technologies, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Classification
- Weakness
- CWE-416 Use After Free
References
- qualcomm.com /company/product-security/bulletins · x_refsource_CONFIRM, x_transferred
Sources
- CVE List: CVE-2017-18157
- NVD: CVE-2017-18157
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